MECHANIC HX‑T100 Rosin Core Tin Solder Wire, Diameter:0.8mm 500g Lead

1. High?purity tin/lead alloy (63% Sn / 37% Pb) with 1.0?3.0% flux and <0.1% CI; bright, full solder joints and excellent solderability.

2. Low melting point (183? degree Celsius) provides bright, consistent joints on phone circuit boards; affordable and easy to use.

3. Anti?oxidation and anti?corrosion properties give superior desoldering performance; suitable for motherboards, electronic devices, and more.

4. Produces minimal residue, bright spots, and reliable connections.

5. Low spatter, smokeless operation with a relaxed odor.

6. Corrosion?resistant formulation.

7. Compact and portable – a must?have tool for electronics enthusiasts.

Specification: