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RELIFE TO6 6 In 1 High Purity Copper Solder Mopping Pin Set Cell Phone Motherboard Repair Solder Mopping
RELIFE TO6 6 In 1 High Purity Copper Solder Mopping Pin Set Cell Phone Motherboard Repair Solder Mopping
RELIFE TO6 6 In 1 High Purity Copper Solder Mopping Pin Set Cell Phone Motherboard Repair Solder Mopping
RELIFE TO6 6 In 1 High Purity Copper Solder Mopping Pin Set Cell Phone Motherboard Repair Solder Mopping
RELIFE TO6 6 In 1 High Purity Copper Solder Mopping Pin Set Cell Phone Motherboard Repair Solder Mopping
RELIFE TO6 6 In 1 High Purity Copper Solder Mopping Pin Set Cell Phone Motherboard Repair Solder Mopping
RELIFE TO6 6 In 1 High Purity Copper Solder Mopping Pin Set Cell Phone Motherboard Repair Solder Mopping
RELIFE TO6 6 In 1 High Purity Copper Solder Mopping Pin Set Cell Phone Motherboard Repair Solder Mopping

RELIFE TO6 6 In 1 High Purity Copper Solder Mopping Pin Set Cell Phone Motherboard Repair Solder Mopping

€4.72
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Dispatch within 3–5 days.
Delivery time depends on the selected delivery method.
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Price and delivery

LABUS ID: 104311

4,72 € incl. VAT3,90 € excl. VAT

Delivery to Lithuania. All displayed prices include VAT.

Delivery is recalculated for all items together in the cart.

1. Pure copper gold-plated needle, tinning speed increased by 50%

2. Ball head design, can go deep into the gap, quickly complete the row of pins drag tin, and not easy to scratch the motherboard

3. Containing 5 tin dragging pins, even/fast, full of tin

4. Can be easily operated in small space, not easy to scratch the inline holder

5. Suitable for motherboard maintenance tin drag, especially suitable for BGA package chip tin drag

6. Size: Handle about 11.8 x 0.8cm, Needle about 2 x 0.12cm

7. Net weight: about 21.4g

Specification:

  • Reference
    104311
LABUS – MB EP TRADE
Seller registered in Lithuania. Contact details and company information.
Delivery options
ECONOMY 10–20 days · Direct 8–12 days · Express 3–6 days
Returns
Online purchases: 14-day right of withdrawal. See conditions and exceptions.

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